Silicon Solar Cell Grid And Bus Bar Design Engineering Essay

Silicon solar Cell Grid And charabanc Bar Design Engineering EssayIn this story, we shall be designing and explaining the dish for fabricating the top grid and motor cumulusbar electrodes for a crystalline ti solar booth using commercial dish uping techniques, such as book binding- printing. The solar stall must be kept at a minimum of 20.8% transformation susceptibility and we must keep our power losings under 8% using commercially uncommitted technology and signs. interpolationSolar stall technology is a rapidly growing number of power generation. T here(predicate) be new and improved act upones being unquestionable and understood all the time. In this paper, we willing introduce, design, and foreshadow the properties and a handle of fabricating a crystalline ti solar electric jail cell.A solar cell is an electronic device that converts sunlight into galvanicity, using what is known as the photovoltaic effect. The photovoltaic effect is the basic physica l process in which a PV cell converts sunlight into energy. The sunlight, containing photons, strikes the PV cell and argon either reflected or absorbed. When the PV cell absorbs a photon with an adequate energy level, an electron is excited to the conduction band, which produces a hole in the valence band. at one time the electron-hole pair is varianted, the built-in electric field separates the electron from the hole and accordinglyce the two charges net supply to catamenia f small-scale in the PV cell. Once this hole is formed a built-in electric field is take to drive the current to an foreign load, as essenceing one is connected.The built in electric field is a property of the PV cell consisting of an n-type (negative) and a p-type (positive) semiconductor formed to keepher. When these two sensibles, commonly positively or negatively drugged silicon, are in concert, they compose a pathway for excess electrons in the n-type material to flow to the p-type material. Th is causes the holes to flow into the n-type material from the p-type material. Through this process of electron and hole flow, the electric field is created and needed to force the electrons to jump to the surface in order to be count available for use in the electrical circuit as shown below in variant 1. 1With light, charge imbalance, generates voltage crossways terminalsNo voltage across diode, No CurrentLoad connected, Current flowsFigure 1 incompatible stages of PV cell 2.ProblemOur job was to design grids and busbars, outline a manufacture process for put optionting down the grids and busbars on top of the crystalline silicon solar cell using commercial printing inks for making ohmic clashings, and describe the commercial processing techniques we are using, such as harbor-printing. Our initial constraints are that the silicon solar cell is a consecutive such that its dimensions are 10cm by 10cm. Also, the cell is such that, when there are no insubordinate or grid-shado wing red inkes, it produces a current density of 40 mA/cm2. The cell also produces a voltage of 0.65 V, a fill reckon of 80% and an energy conversion efficiency of 20.8%. We are assuming that the plane resistance of the p form is 100 ohms/square. We also must calculate the shadowing loss due to the blocked sunlight from the grids and the busbar on the solar cell. In addition to those losings, we must take into account the resistive losses in the top junction layer with the cells carpenters plane resistance, grids and busbars. period fabricating this solar cell, the losses are to be minimized such that the sum is to be less than 8%.MATHEMATICAL DERIVATIONSIn this section the numerical equations for calculating various losses in the solar cell will be derived. Below in table 1 is the design parameters and constraints effrontery for this solar cell.Parameters accustomed in the design project specificationsParameter nourishDescriptionLight-generated current densityOpen-circuit v oltageFill factor efficacy conversion efficiencySheet resistance of the p-layerArea of the solar cell remand 1 Design parameters for solar cellUsing the parameters prone above, the optical power incident on the solar cell is given by manipulating the equation into the form which gives.The power generated by the cell is given by.The voltage at the maximum power point Vm is ascertain by using the adjacent equation2.Using this value of Vm, the current at the maximum power point Im was because determined with the following equationThe losses in the solar cell are caused by resistance in the bus bar, resistance in the fingerbreadths, resistance in the base and emitter layers, and shadowing by the bus bar and fingers. The resistance per square of the ink used in this cell is measured at 25m thick 5. The resistivity of the ink is then calculated by.A MATLAB program was written to help determine the optimum space between the fingers of the solar cell. The code that was written can be seen in the lynchpin of this paper located in the appendix. The graph generated by the program is in build 2. CUsersGenDocumentsEE 332Final ProjectFinger Spacing Chart.pngFigure 2 substance Power Loss versus Finger Spacing.From the graph we determined the optimal spacing between fingers to be 2.5mm. The power lost in each finger is given bywhere Lf is the length of the finger, Sf is the spacing between fingers, f is the resistivity of the finger, wf is the width of the finger, and df is the height of the finger. A summary of the design parameters used here are shown in table 2. Once the power lost in each finger is known, the total resistive losses in the fingers can be calculated by multiplying by the number of fingers.The power loss in the bus bar is calculated bywhere Lb is the length of the bus bar, b is the resistivity of the bus bar, wb is the width of the bus bar, and db is the height of the bus bar.The power loss in the emitter of the solar cell is calculated bywher e em is the resistance per square of the emitter. at that place are losses due to shadowing of the solar cell caused by the fingers and bus bar blocking light. The shadowing losses is calculated bywhere Nb is the number of bus bars.The total power losses in the solar cell is then calculated by.We can then determine the percentage of power losses to bewhich is below the 8% loss specified for this design project.CELL FABRICATION TECHNOLOGIESCell untruthWhen it comes to fabrication techniques of solar cells there are a few techniques to split up from. These choices mainly consist of test printed solar cells, buried contact solar cells, high efficiency solar cells, and rear contact solar cells. For the draw a bead on of this paper the method of choice that will be used is filmdom printing. The secrete printing process can be a cheaper process and is often comprised of fewer foot pure tones than different methods. covering printing has been approximately for quite some time, tho ugh originally designed for printing graphics, advertisements, flyers, etcetera one of these overwhelm door printing machines can be seen in figure 2.http//www.phoseon.com/img/Screen_Print_iStock_000008690558XSmall.jpgFigure 2 One of the arms of a machine that holds a secrete, squeegee, and ink. 3As far as the physical screen printing bunch of semiconducting devices or in our case a solar cell it is a pretty simple idea. A screen is created in the form of a negative only when as film in a camera. Certain areas of the screen allow ink to pass through and others do not. This screen can be made of unalike materials such as silk, coat, plastics. The screen is used to hold the ink that will be transferred to the send object, in this particular scenario a wafer of crystalline silicon or c-Si. motto damage etchAfter the blocks of silicon are cut into wafers, well-nigh .5mm thick, the saw leaves behind a residue that was used as a coolant during the cutting process. 2 The wafers g et loaded into cassettes so that they can be cleaned as show in figure 3. The wafers are then cleaned in a hot sodium hydroxide bath to absent the contamination unexpended behind. This process removes the first 10 micrometers of silicon which was damaged during the cutting process. Once this has taken place the silicon is then laid into another, more diluted, sodium hydroxide bath which has been mixed with isopropanol as a leakage agent to etch the surface of the silicon wafers. This process gives a rattling uniform etch rate when c-Si wafers are used as the original substrate.http//www.pveducation.org/sites/default/files/PVCDROM/Manufacturing/Images/MVC-420F.JPGFigure 3 Multicrystalline silicon wafers in cassettes are fixate to be cleaned 2.Junction formation by dopingThe wafers have now been cleaned and are ready to be doped. This process will create an n-type layer on the c-Si. This n-type layer is created by applying a match coating to the silicon and then firing the waf ers. The wafers are in what is called a diffusion coating furnace where the layer of phosphorus is deposited on to the wafers. The wafers are then moved to a different furnace where they are fired at a temperature roughly 800-1000 degrees Celsius. The firing process incorporates the phosphorus layer into the outer surface of the silicon wafer.Edge isolationEdge isolation is a process in which the newly doped silicon wafers have the front and screening sides isolated from each other. This is through by first stacking the wafers together and then loading them in to a blood plasma etching system. In this system the sides of the wafers will be plasma etched by using CF4 and O2. This process will remove the phosphorus dopant from the sides of the wafers thus separating the two n-type surfaces encompassing the silicon.Anti-reflection coatingOne more step is needed before the wafers can begin the screen printing process and this is the application of an anti-reflection coating. This is a very important step because it is this coating that helps to curb the amount of reflected photons, which in turn helps increase the efficiency of the solar cell.4For this step silicon nitride is used via a process called chemical vapor sedimentation process or CVD. During this process the chemicals are fed into the deposition put up and they break down and adhere to the wafer. The actual chemical process for this is 3SiH4 + 4NH3 - Si3N4 + 12H2. 2Screen printing the rear contactNow that the wafers have been doped, the front and thorn have been isolated from each other, and they have been coated with an anti-reflection coating they are now ready to receive the rear contacts. This is done through the screen printing process discussed earlier on in this paper. A screen carrying a metallic element glue is lowered over the top of the solar cell and then a squeegee pushes the facing pages through holes, transferring it to the cell in the desired pattern, this can be seen below in f igure 4. This process is usually repeated twice for both the front and back sides of the solar cell, each of which both distributing different patterns to the solar cell. The first usually deposits an aluminum mask across the back of the cell to create the back surface field. 2Figure 4 Squeegee pushing metallic ink across a screen. 2The cell is then dried in an oven to remove all of the organic solvents and binders before the next screen takes place. The second screen on the back of the solar cell deposits a silver paste which is used for the contacts on the solar cell.After performing the second screen print on the back of the solar cell it is then placed in to an oven and fired at a higher(prenominal) temperature. During this process the metal and wafer are heated to a high enough temperature to destroy the n-layer allowing the metals printed on the cell to become in contact with the p-type silicon itself.Screen printing the front contactNow that we have printed the back side of t he solar cell it gets flipped over for the printing of the conductive fingers and the main busbars. This is the exact analogous process as explained earlier when printing the rear side of the solar cell except for the fact that the screens will have different designs to create the buss bar and finger system as mentioned. For the purpose of this paper we will be using a DuPont Solamet PV412 ink. The properties of this ink can be seen below in figure 5.Figure 5 Specification sheet for DuPont Solamet PV412 ink. 5In between these two steps the wafers will be put into a drier around 200 degrees Celsius to dry the ink as said before on the back side. Once the second screen is transferred the wafer will again go back into an oven to fire the chosen metal paste into the silicon. A finished image of the front of a solar cell is shown in figure 6.http//www.ecn.nl/typo3temp/pics/db94f2dc2b.pngFigure 6 Front of a finished solar cell 6TECHNOLOGIES CHOSEN FOR THIS APPLICATIONWhy screen printing is usedScreen printing technology, where a metal-containing conductive paste is forced through the openings of a screen onto a wafer to form the circuits or contacts, is one of the beat out established and one of the most mature forms of solar cell fabrication technology. 7 First developed in the 1970s, screen-printing is currently the ascendant form of fabrication of photovoltaic modules. 2 While screen printing does snub the efficiency of a solar cell by 3.5-4% when comparing it to the best and more expensive methods, however, there are advantages to this fabrication method. 6 Some of the notice advantages are the technologys simplicity in fabricating the solar cell, its terms-effectiveness and its ease of control.Why silicon is usedCurrently, crystalline silicon is the dominant material used in the photovoltaic market, even though silicon does not have optimum material parameters. Specifically, its band gap is a little too low for an optimum solar cell and it has a low absor ption coefficient. delinquent to silicons abundance and its prominence in the manufacturing industry, silicon still makes it difficult for other materials to compete in this market. 8Why silver is usedMany factors come into play when deciding the material to be used in the solar cell. Some factors include the materials efficiency, its conductivity, its adhesion effect, as well as its cost effectiveness. Silver, being a great conductor of electricity, is used in the contact points. A well-formulated silver paste could have almost 50% higher conductivity compared to other pastes. 9 Silver also has great adhesion strength that meets the general costumer requirements.FINAL FABRICATION PROCESS DESCRIPTION dodge 2 is a summary of the final design parameters for this solar cell.Table 2 Final Design ParametersParameterValueDescriptionpotential at maximum power outputCurrent density at max power outputMaximum power output without lossesResistance per square of the emitter 10Resistance per square of the ink 5Resistivity of the inkSpacing between fingersWidth of the fingersHeight of the fingersLength of the fingers80 play of fingersLength of the bus barWidth of the bus barTable 3 is a summary of the calculated losses of the solar cell associated with the grid and bus bars.Table 3 Calculated Power lossesPower losses due to shadowingPower losses in the emitterPower losses in the fingersPower losses in the bus barTotal power lossesPercentage power lossesThe Final FabricationAfter all of the multiple steps of screen printing are completed and the wafers have been fired at the charm temperatures for the correct amount of time, the solar cells are complete. Keep in psyche that the stages of manufacturing where the wafers are fired must be done correctly to get the desired solar cell. If the temperature is to high this will cause the metals to melt together and make contact with others causing possible short circuit or giving the wafer improper properties. After this proce ss is successfully completed, the cells can then have leads soldered to the back sides of them. This completes production of the physical solar cell and just leaves the process of soldering leads to the back side of the wafers which will allow the cells to be wired in series to achieve the desired output voltage.In conclusion the initial parameters included a minimum of 20.8% conversion efficiency and the power loss was to be kept under 8% by using commercially available inks and technology. We were able to achieve a conversion efficiency of 20.8% and we were able to reduce our power lost to 4.64% by screen printing our c-Si solar cells and also reducing the width while change magnitude the height of the fingers and busbars.REFERENCES1 Reprinted from U.S. Department of Energy photovoltaics Program. Online. Availablehttp//inventors.about.com/library/inventors/blsolar3.htm Nov. 15, 20122 Christiana Honsberg, Stuart Bowden. Photovoltaic nurture Network Online. Available http//www.pve ducation.org/ Nov. 1, 2012 .3 Phoseon Technology Screen Printing. Online. Available http//www.phoseon.com/applications/screen-printing.htm Nov. 4, 20124 Daniel Nilsen Wright. (2008, Jan, 16) Anti-reflection coatings for silicon solar cells Online. Available http//www.sintef.no/uploadpages/24509/Daniel%20N%20Wright.pdf Nov 3, 20125 DuPont Solamet PV412 photovoltaic metallization Online. Available http//www2.dupont.com/MCM/en_US/assets/downloads/prodinfo/Solamet_PV412.pdf6 Jaap Hoornstra. Better printing delivers more solar power. ECN (Sep. 2010). Online. Available http//www.ecn.nl/nl/nieuws/newsletter-en/2010/september-2010/two-stage- screen-printing-improves-solar-cell/ Nov. 6, 20127 Applied Materials. (April 2011). Screen Printing For Crystalline Silicon Solar Cells. Online. Available http//www.appliedmaterials.com/sites/default/files/ Nov. 15, 20128 Jessika Toothman and Scott Aldous. How Solar Cells Work. Online. Availabe http//science.howstuffworks.com/environmental/energy/solar- cell2.htm Nov. 15, 20129 Dr. Weiming Zhang. How Silver spread head Can Improve Silicon Solar Cell Performance/ bell Ratio. Online. Available http//pvsilverpaste.com/media/webmedia_local/media/whitepapers/HowSilverPasteCanI mproveYourPerformance.pdf Nov. 15, 201210 Yelundur, V. Nakayashiki, K. Hilali, M. Rohatgi, A. , Implentation of a homogeneous high-sheet-resistance emitter in multicrystalline silicon solar cells, Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE , vol., no., pp. 959- 962, 3-7 Jan. 2005 URL http//ieeexplore.ieee.org/stamp/stamp.jsp?tp=arnumber=1488291 isnumber=31426